Welcome to ISPMP 2022
2023 International Symposium on Physical Materials and Physics
Welcome to ISPMP 2022
2023 International Symposium on Physical Materials and Physics
Jan Faigl, Czech Technical University in Prague, Czech
Jee Hou Ho, The University of Nottingham Malaysia Campus, Malaysia
Le Anh Tuan, Vietnam Maritime University, Vietnam
Gheorghe-Daniel Andreescu, Politehnica University of Timisoara, Romania
Wan Zuha Wan Hasan, Universiti Putra Malaysia, Malaysia
Huosheng Hu, University of Essex, UK
Wang Han, Nanyang Technological University, Singapore
Giuseppe Conte, Università Politecnica delle Marche, Italy
Mo-Yuen Chow, North Carolina State University, USA
Prof. (Dr.) Sailesh Iyer Rai University, Ahmedabad
Xinggang Yan, University of Kent, UK
Wencen Wu, San Jose State University, USA
Mohammad Salah, The Hashemite University, Jordan
Mohd Aliff Afira Hj Sani, Universiti Kuala Lumpur, Malaysia
Muthukumar Subramanyam, BIT- ANNA University Trichy Campus, India
Noorlin Mohd Ali, Universiti Malaysia Pahang, Malaysia
Reza Sadeghi, University of New Haven, USA
Sharmila. B, Sri Ramakrishna Engineering College, India
Spilios Fassois, the University of Patras, Greece
Vojtěch Vonásek, Czech Technical University in Prague, Czech
Prof Alamgir Hossain Cambodia University of Technology & Science
A.D.Yilun Shang,Northumbria University, UK
Prof tahar kechadi, University of Dublin, Ireland
Prof Phoebe Chen La Trobe University
Prof. Jinlin Xue, Nanjing Agricultural University, China
Prof. Chao Ma, Shanghai Jiao Tong University, China
A. Prof. Weiting Chen, East China Normal University, China
A. Prof. Zhengdao Zhang, Jiangnan University, China
Mail Address: ispmp_info@126.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists: